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Webinar: A comparison of module sintering vs. soldering—best performance vs. best cost


SiC chips have revolutionized not only the performance of power modules but also the surrounding packaging technologies. Chips are no longer soldered but sintered, die top connections are no longer Aluminum wires but Cu wires on die top systems or Cu clips. So, what is the next level module connection? Sintering with large area silver… Read more…